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            Free, publicly-accessible full text available July 1, 2026
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            Two-dimensional (2D) kagome lattice metals are interesting because their corner sharing triangle structure enables a wide array of electronic and magnetic phenomena. Recently, post-growth annealing is shown to both suppress charge density wave (CDW) order and establish long-range CDW with the ability to cycle between states repeatedly in the kagome antiferromagnet FeGe. Here we perform transport, neutron scattering, scanning transmission electron microscopy (STEM), and muon spin rotation (μSR) experiments to unveil the microscopic mechanism of the annealing process and its impact on magneto-transport, CDW, and magnetism in FeGe. Annealing at 560 °C creates uniformly distributed Ge vacancies, preventing the formation of Ge-Ge dimers and thus CDW, while 320 °C annealing concentrates vacancies into stoichiometric FeGe regions with long-range CDW. The presence of CDW order greatly affects the anomalous Hall effect, incommensurate magnetic order, and spin-lattice coupling in FeGe, placing FeGe as the only kagome lattice material with tunable CDW and magnetic order.more » « lessFree, publicly-accessible full text available April 7, 2026
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            Abstract With shrinking dimensions in integrated circuits, sensors, and functional devices, there is a pressing need to develop nanofabrication techniques with simultaneous control of morphology, microstructure, and material composition over wafer length scales. Current techniques are largely unable to meet all these conditions, suffering from poor control of morphology and defect structure or requiring extensive optimization or post‐processing to achieve desired nanostructures. Recently, thermomechanical nanomolding (TMNM) has been shown to yield single‐crystalline, high aspect ratio nanowires of metals, alloys, and intermetallics over wafer‐scale distances. Here, TMNM is extended for wafer‐scale fabrication of 2D nanostructures. Using In, Al, and Cu, nanomold nanoribbons with widths < 50 nm, depths ≈0.5–1 µm and lengths ≈7 mm into Si trenches at conditions compatible is successfully with back end of line processing . Through SEM cross‐section imaging and 4D‐STEM grain orientation maps, it is shown that the grain size of the bulk feedstock is transferred to the nanomolded structures up to and including single crystal Cu. Based on the retained microstructures of molded 2D Cu, the deformation mechanism during molding for 2D TMNM is discussed.more » « less
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